JPH02149765U - - Google Patents
Info
- Publication number
- JPH02149765U JPH02149765U JP5764689U JP5764689U JPH02149765U JP H02149765 U JPH02149765 U JP H02149765U JP 5764689 U JP5764689 U JP 5764689U JP 5764689 U JP5764689 U JP 5764689U JP H02149765 U JPH02149765 U JP H02149765U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- anode
- semiconductor wafer
- cup
- plating cup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5764689U JPH02149765U (en]) | 1989-05-18 | 1989-05-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5764689U JPH02149765U (en]) | 1989-05-18 | 1989-05-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02149765U true JPH02149765U (en]) | 1990-12-21 |
Family
ID=31582544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5764689U Pending JPH02149765U (en]) | 1989-05-18 | 1989-05-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02149765U (en]) |
-
1989
- 1989-05-18 JP JP5764689U patent/JPH02149765U/ja active Pending